Qualcomm Snapdragon 855+ Mobile Platform (sm8150-ac) Firmware
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cpe:2.3:o:qualcomm:snapdragon_855\+_mobile_platform_\(sm8150-ac\)_firmware:-:*:*:*:*:*:*:*
part: o version: - update: *
| Vendor | Qualcomm (4194a0de-9926-556d-a143-7609c2315dd6) |
|---|---|
| Product | Snapdragon 855+ Mobile Platform (Sm8150 Ac) Firmware (5f01c8dd-4bbf-54e3-94e2-c188fcc3dcfc) |
| Edition | * |
| Language | * |
| Software edition | * |
| Target software | * |
| Target hardware | * |
| Other | * |
| Notes | Imported from NVD CPE 2.0 feed |
PURL mappings
| PURL | Source | Last updated |
|---|---|---|
| No PURL mappings for this CPE yet. | ||
Vulnerability references
| Identifier | cpeApplicability | Submitted | db.gcve.eu details | Rationale |
|---|---|---|---|---|
CVE:CVE-2024-23353 |
vulnerable | 2026-06-08 06:29:37.904724 |
Buffer Over-read in Multi Mode Call Processor
HIGH (7.5)
Transient DOS while decoding attach reject message received by UE, when IEI is set to ESM_IEI.
Published: 2024-08-05T14:21:21.075Z
Updated: 2024-08-05T15:14:49.239Z |
Imported from gcve-enriched-dumps CVE data |
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