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cpe:2.3:o:qualcomm:qualcomm_dragonwing_x100_accelerator_card_firmware:-:*:*:*:*:*:*:*

part: o version: - update: *

VendorQualcomm (4194a0de-9926-556d-a143-7609c2315dd6)
ProductQualcomm Dragonwing X100 Accelerator Card Firmware (4574789f-f8d7-5b6b-a67d-3c3a69e0af3c)
Edition*
Language*
Software edition*
Target software*
Target hardware*
Other*
NotesImported from NVD CPE 2.0 feed

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Vulnerability references

IdentifiercpeApplicabilitySubmitteddb.gcve.eu detailsRationale
CVE:CVE-2025-47373 vulnerable 2026-06-08 07:27:12.886771 Out-of-bounds Write in Automotive
HIGH (7.8)
Memory Corruption when accessing buffers with invalid length during TA invocation.
Published: 2026-03-02T16:53:44.535Z
Updated: 2026-03-02T19:09:28.558Z
Reference links
Imported from gcve-enriched-dumps CVE data

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