Eudora Worldmail
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cpe:2.3:a:qualcomm:eudora_worldmail:3.0_version_6.1.22.0:*:*:*:*:*:*:*
part: a version: 3.0_version_6.1.22.0 update: *
| Vendor | Qualcomm (4194a0de-9926-556d-a143-7609c2315dd6) |
|---|---|
| Product | Eudora Worldmail (ae3aca12-9c83-58b9-83c2-35ea6541e1ce) |
| Edition | * |
| Language | * |
| Software edition | * |
| Target software | * |
| Target hardware | * |
| Other | * |
| Notes | Imported from gcve-enriched-dumps CVE data |
PURL mappings
| PURL | Source | Last updated |
|---|---|---|
| No PURL mappings for this CPE yet. | ||
Vulnerability references
| Identifier | cpeApplicability | Submitted | db.gcve.eu details | Rationale |
|---|---|---|---|---|
CVE:CVE-2006-6024 |
vulnerable | 2026-06-08 04:49:21.815630 |
Details available
Multiple buffer overflows in Eudora Worldmail, possibly Worldmail 3 version 6.1.22.0, have unknown impact and attack vectors, as demonstrated by the (1) "Eudora WorldMail stack overflow" and (2) "Eudora WorldMail heap overflow" modules in VulnDisco Pack. NOTE: Some of these details are obtained from third party information. As of 20061118, this disclosure has no actionable information. However, because the VulnDisco Pack author is a reliable researcher, the issue is being assigned a CVE identifier for tracking purposes.
Published: 2006-11-21T23:00:00.000Z
Updated: 2025-04-03T15:54:05.043Z |
Imported from gcve-enriched-dumps CVE data |
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