Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear
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cpe:2.3:a:qualcomm_technologies,_inc.:snapdragon_automobile,_snapdragon_mobile,_snapdragon_wear:*:*:*:*:*:*:*:*
part: a version: * update: *
| Vendor | Qualcomm Technologies, Inc. (9d8a5959-35d6-5b22-a4ce-4ad9ce4d59d1) |
|---|---|
| Product | Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear (e5c1018e-9322-5cd2-8157-117a47462a82) |
| Edition | * |
| Language | * |
| Software edition | * |
| Target software | * |
| Target hardware | * |
| Other | * |
| Notes | Imported from gcve-enriched-dumps CVE data |
PURL mappings
| PURL | Source | Last updated |
|---|---|---|
| No PURL mappings for this CPE yet. | ||
Vulnerability references
| Identifier | cpeApplicability | Submitted | db.gcve.eu details | Rationale |
|---|---|---|---|---|
CVE:CVE-2017-18278 |
vulnerable | 2026-06-08 05:09:10.684108 |
Details available
An integer underflow may occur due to lack of check when received data length from font_mgr_qsee_request_service is bigger than the minimal value of the segment header, which may result in a buffer overflow, in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850.
Published: 2019-05-06T22:54:13.000Z
Updated: 2024-08-05T21:13:49.242Z Reference links |
Imported from gcve-enriched-dumps CVE data |
CVE:CVE-2017-18275 |
vulnerable | 2026-06-08 05:09:10.665974 |
Details available
A new account can be inserted into simContacts service using Android command line tool in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845.
Published: 2019-05-06T22:43:05.000Z
Updated: 2024-08-05T21:13:49.291Z Reference links |
Imported from gcve-enriched-dumps CVE data |
CVE:CVE-2017-18274 |
vulnerable | 2026-06-08 05:09:10.664621 |
Details available
While iterating through the models contained in a fixed-size array in the actData structure, which also stores an incorrect number of models that is greater than the size of the array, a buffer overflow occurs in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835
Published: 2019-05-06T22:37:54.000Z
Updated: 2024-08-05T21:13:49.235Z Reference links |
Imported from gcve-enriched-dumps CVE data |
CVE:CVE-2017-18157 |
vulnerable | 2026-06-08 05:09:10.497209 |
Details available
A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.
Published: 2019-05-06T22:31:47.000Z
Updated: 2024-08-05T21:13:48.623Z Reference links |
Imported from gcve-enriched-dumps CVE data |
CVE:CVE-2017-18156 |
vulnerable | 2026-06-08 05:09:10.496034 |
Details available
While processing camera buffers in camera driver, a use after free condition can occur in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 625, SD 820, SD 820A, SD 835, SDX20.
Published: 2019-05-06T22:28:03.000Z
Updated: 2024-08-05T21:13:48.897Z Reference links |
Imported from gcve-enriched-dumps CVE data |
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