Software Development Kit
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cpe:2.3:a:dialog-semiconductor:software_development_kit:*:*:*:*:*:*:*:*
part: a version: * update: *
| Vendor | Dialog Semiconductor (467be833-9d8f-5e9f-8aad-9adda99670b2) |
|---|---|
| Product | Software Development Kit (8c54ea2e-c3ec-58e0-b4c4-b53a4edf9689) |
| Edition | * |
| Language | * |
| Software edition | * |
| Target software | * |
| Target hardware | * |
| Other | * |
| Notes | Imported from gcve-enriched-dumps CVE data |
PURL mappings
| PURL | Source | Last updated |
|---|---|---|
| No PURL mappings for this CPE yet. | ||
Vulnerability references
| Identifier | cpeApplicability | Submitted | db.gcve.eu details | Rationale |
|---|---|---|---|---|
CVE:CVE-2019-17518 |
vulnerable | 2026-06-08 05:13:10.593438 |
Details available
The Bluetooth Low Energy implementation on Dialog Semiconductor SDK through 1.0.14.1081 for DA1468x devices responds to link layer packets with a payload length larger than expected, allowing attackers in radio range to cause a buffer overflow via a crafted packet. This affects, for example, August Smart Lock.
Published: 2020-02-10T20:22:14.000Z
Updated: 2024-08-05T01:40:15.780Z |
Imported from gcve-enriched-dumps CVE data |
CVE:CVE-2019-17517 |
vulnerable | 2026-06-08 05:13:10.590319 |
Details available
The Bluetooth Low Energy implementation on Dialog Semiconductor SDK through 5.0.4 for DA14580/1/2/3 devices does not properly restrict the L2CAP payload length, allowing attackers in radio range to cause a buffer overflow via a crafted Link Layer packet.
Published: 2020-02-10T20:18:55.000Z
Updated: 2024-08-05T01:40:15.755Z |
Imported from gcve-enriched-dumps CVE data |
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