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cpe:2.3:a:qualcomm,_inc.:snapdragon_auto,_snapdragon_connectivity,_snapdragon_mobile:*:*:*:*:*:*:*:*

part: a version: * update: *

VendorQualcomm, Inc. (ca652b28-b369-506c-bdcb-4c0ec4fdabf2)
ProductSnapdragon Auto, Snapdragon Connectivity, Snapdragon Mobile (050e6fdf-ee56-555c-acf9-7e8a187db791)
Edition*
Language*
Software edition*
Target software*
Target hardware*
Other*
NotesImported from gcve-enriched-dumps CVE data

PURL mappings

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Vulnerability references

IdentifiercpeApplicabilitySubmitteddb.gcve.eu detailsRationale
CVE:CVE-2020-11187 vulnerable 2026-06-08 05:16:39.673073 Details available
Possible memory corruption in BSI module due to improper validation of parameter count in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Mobile
Published: 2021-02-22T06:25:52.000Z
Updated: 2024-08-04T11:28:13.339Z
Reference links
Imported from gcve-enriched-dumps CVE data

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