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cpe:2.3:a:qualcomm,_inc.:snapdragon_auto,_snapdragon_compute,_snapdragon_connectivity,_snapdragon_consumer_electronics_connectivity,_snapdragon_consumer_iot,_snapdragon_industrial_iot,_snapdragon_wearables:*:*:*:*:*:*:*:*

part: a version: * update: *

VendorQualcomm, Inc. (ca652b28-b369-506c-bdcb-4c0ec4fdabf2)
ProductSnapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer Iot, Snapdragon Industrial Iot, Snapdragon Wearables (a5ce0ee6-7f80-56f8-890b-af9077eef9cf)
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NotesImported from gcve-enriched-dumps CVE data

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Vulnerability references

IdentifiercpeApplicabilitySubmitteddb.gcve.eu detailsRationale
CVE:CVE-2021-30341 vulnerable 2026-06-08 05:31:50.646581 Details available
CRITICAL (9.8)
Improper buffer size validation of DSM packet received can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables
Published: 2022-06-14T10:10:58.000Z
Updated: 2024-08-03T22:32:40.339Z
Reference links
Imported from gcve-enriched-dumps CVE data

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