Bond Pro Firmware
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cpe:2.3:o:teradek:bond_pro_firmware:*:*:*:*:*:*:*:*
part: o version: * update: *
| Vendor | Teradek (3f9544c8-d3d5-5104-98c2-63fc8414c897) |
|---|---|
| Product | Bond Pro Firmware (f754886e-c7f9-557e-9400-e0f83dcb0f02) |
| Edition | * |
| Language | * |
| Software edition | * |
| Target software | * |
| Target hardware | * |
| Other | * |
| Notes | Imported from gcve-enriched-dumps CVE data |
PURL mappings
| PURL | Source | Last updated |
|---|---|---|
| No PURL mappings for this CPE yet. | ||
Vulnerability references
| Identifier | cpeApplicability | Submitted | db.gcve.eu details | Rationale |
|---|---|---|---|---|
CVE:CVE-2021-37376 |
vulnerable | 2026-06-03 14:45:00.490313 |
Details available
Cross Site Scripting (XSS) vulnerability in Teradek Bond, Bond 2 and Bond Pro firmware version 7.3.x and earlier allows remote attackers to run arbitrary code via the Friendly Name field in System Information Settings. NOTE: Vedor states the product has reached End of Life and will not be receiving any firmware updates to address this issue.
Published: 2023-02-03T00:00:00.000Z
Updated: 2024-08-04T01:16:03.790Z |
Imported from gcve-enriched-dumps CVE data |
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