Snapdragon Mobile, Snapdragon Wearables
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cpe:2.3:a:qualcomm,_inc.:snapdragon_mobile,_snapdragon_wearables:*:*:*:*:*:*:*:*
part: a version: * update: *
| Vendor | Qualcomm, Inc. (ca652b28-b369-506c-bdcb-4c0ec4fdabf2) |
|---|---|
| Product | Snapdragon Mobile, Snapdragon Wearables (fb578969-3ab3-5d8a-a9d1-e2e2527c6a0b) |
| Edition | * |
| Language | * |
| Software edition | * |
| Target software | * |
| Target hardware | * |
| Other | * |
| Notes | Imported from gcve-enriched-dumps CVE data |
PURL mappings
| PURL | Source | Last updated |
|---|---|---|
| No PURL mappings for this CPE yet. | ||
Vulnerability references
| Identifier | cpeApplicability | Submitted | db.gcve.eu details | Rationale |
|---|---|---|---|---|
CVE:CVE-2022-25698 |
vulnerable | 2026-06-08 05:41:48.060103 |
Details available
HIGH (8.4)
Memory corruption in SPI buses due to improper input validation while reading address configuration from spi buses in Snapdragon Mobile, Snapdragon Wearables
Published: 2022-12-13T00:00:00.000Z
Updated: 2025-04-22T15:55:49.006Z |
Imported from gcve-enriched-dumps CVE data |
CVE:CVE-2022-25697 |
vulnerable | 2026-06-08 05:41:48.057988 |
Details available
HIGH (8.4)
Memory corruption in i2c buses due to improper input validation while reading address configuration from i2c driver in Snapdragon Mobile, Snapdragon Wearables
Published: 2022-12-13T00:00:00.000Z
Updated: 2025-04-22T15:56:12.394Z |
Imported from gcve-enriched-dumps CVE data |
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