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cpe:2.3:h:qualcomm:sd810:-:*:*:*:*:*:*:*

part: h version: - update: *

VendorQualcomm (4194a0de-9926-556d-a143-7609c2315dd6)
ProductSd810 (1e22261b-d44c-5144-ab0a-d711603fdfc1)
Edition*
Language*
Software edition*
Target software*
Target hardware*
Other*
NotesImported from NVD CPE 2.0 feed

PURL mappings

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Vulnerability references

IdentifiercpeApplicabilitySubmitteddb.gcve.eu detailsRationale
CVE:CVE-2018-11982 not_vulnerable 2026-06-08 05:10:39.639267 Details available
In Snapdragon (Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 835, Snapdragon_High_Med_2016, a double free of ASN1 heap memory used for EUTRA CAP container occurs during UTRAN to LTE Capability inquiry procedure.
Published: 2018-09-20T13:00:00.000Z
Updated: 2024-08-05T08:24:03.377Z
Reference links
Imported from gcve-enriched-dumps CVE data
CVE:CVE-2018-11291 not_vulnerable 2026-06-08 05:10:38.296532 Details available
In Snapdragon (Automobile, Mobile, Wear) in version IPQ8074, MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, QCA4531, QCA6174A, QCA6564, QCA6574, QCA6574AU, QCA6584, QCA6584AU, QCA9377, QCA9378, QCA9379, SD 425, SD 427, SD 430, SD 435, SD 450, SD 600, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDM630, SDM632, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016, cryptographic issues due to the random number generator was not a strong one in NAN.
Published: 2018-09-20T13:00:00.000Z
Updated: 2024-08-05T08:01:52.821Z
Reference links
Imported from gcve-enriched-dumps CVE data
CVE:CVE-2018-11285 not_vulnerable 2026-06-08 05:10:38.237064 Details available
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, while parsing FLAC file with corrupted picture block, a buffer over-read can occur.
Published: 2018-09-20T13:00:00.000Z
Updated: 2024-08-05T08:01:52.839Z
Reference links
Imported from gcve-enriched-dumps CVE data
CVE:CVE-2018-11277 not_vulnerable 2026-06-08 05:10:38.207213 Details available
In Snapdragon (Automobile, Mobile, Wear) in version MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, the com.qualcomm.embms is a vendor package deployed in the system image which has an inadequate permission level and allows any application installed from Play Store to request this permission at install-time. The system application interfaces with the Radio Interface Layer leading to potential access control issue.
Published: 2018-09-20T13:00:00.000Z
Updated: 2024-08-05T08:01:52.986Z
Reference links
Imported from gcve-enriched-dumps CVE data
CVE:CVE-2018-11269 not_vulnerable 2026-06-08 05:10:38.172497 Details available
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, a potential buffer overflow exists when parsing TFTP options.
Published: 2018-09-20T13:00:00.000Z
Updated: 2024-08-05T08:01:52.896Z
Reference links
Imported from gcve-enriched-dumps CVE data
CVE:CVE-2018-11268 not_vulnerable 2026-06-08 05:10:38.165131 db.gcve.eu details were skipped to keep the page responsive. Imported from gcve-enriched-dumps CVE data
CVE:CVE-2017-18314 not_vulnerable 2026-06-08 05:09:10.852115 db.gcve.eu details were skipped to keep the page responsive. Imported from gcve-enriched-dumps CVE data

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