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cpe:2.3:o:huawei:e6878-370_firmware:10.0.3.1\(h563sp1c233\):*:*:*:*:*:*:*

part: o version: 10.0.3.1(h563sp1c233) update: *

VendorHuawei (1cc7ae8f-602e-5c48-b475-b8c42c69e952)
ProductE6878 370 Firmware (c6f5fa4c-b6c5-5779-bd65-d8c576b5d0d3)
Edition*
Language*
Software edition*
Target software*
Target hardware*
Other*
NotesImported from NVD CPE 2.0 feed

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Vulnerability references

IdentifiercpeApplicabilitySubmitteddb.gcve.eu detailsRationale
CVE:CVE-2020-1832 vulnerable 2026-06-08 05:21:03.237008 Details available
E6878-370 products with versions of 10.0.3.1(H557SP27C233) and 10.0.3.1(H563SP1C00) have a stack buffer overflow vulnerability. The program copies an input buffer to an output buffer without verification. An attacker in the adjacent network could send a crafted message, successful exploit could lead to stack buffer overflow which may cause malicious code execution.
Published: 2020-05-29T19:06:47.000Z
Updated: 2024-08-04T06:46:30.938Z
Reference links
Imported from gcve-enriched-dumps CVE data
CVE:CVE-2020-1799 vulnerable 2026-06-08 05:21:03.072802 Details available
E6878-370 with versions of 10.0.3.1(H557SP27C233), 10.0.3.1(H563SP1C00), 10.0.3.1(H563SP1C233) has a use after free vulnerability. The software references memory after it has been freed in certain scenario, the attacker does a series of crafted operations through web portal, successful exploit could cause a use after free condition which may lead to malicious code execution.
Published: 2020-05-21T14:11:50.000Z
Updated: 2024-08-04T06:46:30.895Z
Reference links
Imported from gcve-enriched-dumps CVE data

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