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cpe:2.3:o:qualcomm:qcc112_firmware:-:*:*:*:*:*:*:*

part: o version: - update: *

VendorQualcomm (4194a0de-9926-556d-a143-7609c2315dd6)
ProductQcc112 Firmware (6b6806d8-5cf2-514f-acae-40368d517a66)
Edition*
Language*
Software edition*
Target software*
Target hardware*
Other*
NotesImported from NVD CPE 2.0 feed

PURL mappings

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Vulnerability references

IdentifiercpeApplicabilitySubmitteddb.gcve.eu detailsRationale
CVE:CVE-2020-11293 vulnerable 2026-06-08 05:16:45.878809 Details available
MEDIUM (5.1)
Out of bound read can happen in Widevine TA while copying data to buffer from user data due to lack of check of buffer length received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
Published: 2021-05-07T09:10:36.000Z
Updated: 2024-08-04T11:28:13.907Z
Reference links
Imported from gcve-enriched-dumps CVE data
CVE:CVE-2020-11289 vulnerable 2026-06-08 05:16:45.824107 Details available
HIGH (7.8)
Out of bound write can occur in TZ command handler due to lack of validation of command ID in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
Published: 2021-05-07T09:10:36.000Z
Updated: 2024-08-04T11:28:13.857Z
Reference links
Imported from gcve-enriched-dumps CVE data
CVE:CVE-2020-11269 vulnerable 2026-06-08 05:16:44.080285 Details available
Possible memory corruption while processing EAPOL frames due to lack of validation of key length before using it in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
Published: 2021-02-22T06:25:57.000Z
Updated: 2024-08-04T11:28:13.880Z
Reference links
Imported from gcve-enriched-dumps CVE data
CVE:CVE-2020-11251 vulnerable 2026-06-08 05:16:42.858792 Details available
HIGH (8.2)
Out-of-bounds read vulnerability while accessing DTMF payload due to lack of check of buffer length before copying in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Published: 2021-04-07T07:55:34.000Z
Updated: 2024-08-04T11:28:13.800Z
Reference links
Imported from gcve-enriched-dumps CVE data
CVE:CVE-2020-11233 vulnerable 2026-06-08 05:16:41.842395 Details available
Time-of-check time-of-use race condition While processing partition entries due to newly created buffer was read again from mmc without validation in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Published: 2021-06-09T05:00:41.000Z
Updated: 2024-08-04T11:28:13.792Z
Reference links
Imported from gcve-enriched-dumps CVE data
CVE:CVE-2020-11204 vulnerable 2026-06-08 05:16:40.767838 db.gcve.eu details were skipped to keep the page responsive. Imported from gcve-enriched-dumps CVE data
CVE:CVE-2020-11188 vulnerable 2026-06-08 05:16:39.689311 db.gcve.eu details were skipped to keep the page responsive. Imported from gcve-enriched-dumps CVE data
CVE:CVE-2020-11177 vulnerable 2026-06-08 05:16:39.314142 db.gcve.eu details were skipped to keep the page responsive. Imported from gcve-enriched-dumps CVE data
CVE:CVE-2020-11170 vulnerable 2026-06-08 05:16:39.099127 db.gcve.eu details were skipped to keep the page responsive. Imported from gcve-enriched-dumps CVE data

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