GCVE - cpe:2.3:o:qualcomm:wfr1620_firmware:-:*:*:*:*:*:*:*

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cpe:2.3:o:qualcomm:wfr1620_firmware:-:*:*:*:*:*:*:*

part: o version: - update: *

Vendor	Qualcomm (`4194a0de-9926-556d-a143-7609c2315dd6`)
Product	Wfr1620 Firmware (`96ba56a7-6940-5dc8-a783-f580958fe58e`)
Edition	*
Language	*
Software edition	*
Target software	*
Target hardware	*
Other	*
Notes	Imported from NVD CPE 2.0 feed

PURL mappings

PURL	Source	Last updated
No PURL mappings for this CPE yet.

Vulnerability references

Identifier	cpeApplicability	Submitted	db.gcve.eu details	Rationale
`CVE:CVE-2020-11285`	vulnerable	2026-06-08 05:16:45.664051	Details available HIGH (8.2) Buffer over-read while unpacking the RTCP packet we may read extra byte if wrong length is provided in RTCP packets in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Published: 2021-05-07T09:10:34.000Z Updated: 2024-08-04T11:28:13.843Z Open on db.gcve.eu Reference links https://www.qualcomm.com/company/product-security/bulletins/may-2021-bulletin	Imported from gcve-enriched-dumps CVE data
`CVE:CVE-2020-11279`	vulnerable	2026-06-08 05:16:44.322972	Details available HIGH (7.5) Memory corruption while processing crafted SDES packets due to improper length check in sdes packets recieved in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Published: 2021-05-07T09:10:33.000Z Updated: 2024-08-04T11:28:13.858Z Open on db.gcve.eu Reference links https://www.qualcomm.com/company/product-security/bulletins/may-2021-bulletin	Imported from gcve-enriched-dumps CVE data
`CVE:CVE-2020-11177`	vulnerable	2026-06-08 05:16:39.381654	Details available User can overwrite Security Code NV item without knowing current SPC due to improper validation of SPC code setting and device lock in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Published: 2021-02-22T06:25:52.000Z Updated: 2024-08-04T11:28:13.159Z Open on db.gcve.eu Reference links https://www.qualcomm.com/company/product-security/bulletins/february-2021-bulletin	Imported from gcve-enriched-dumps CVE data
`CVE:CVE-2020-11170`	vulnerable	2026-06-08 05:16:39.156688	Details available Out of bound memory access while playing music playbacks with crafted vorbis content due to improper checks in header extraction in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking Published: 2021-02-22T06:25:51.000Z Updated: 2024-08-04T11:28:13.078Z Open on db.gcve.eu Reference links https://www.qualcomm.com/company/product-security/bulletins/february-2021-bulletin	Imported from gcve-enriched-dumps CVE data
`CVE:CVE-2020-11166`	vulnerable	2026-06-08 05:16:38.972293	Details available Potential out of bound read exception when UE receives unusually large number of padding octets in the beginning of ROHC header in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Published: 2021-03-17T06:00:48.000Z Updated: 2024-08-04T11:28:12.574Z Open on db.gcve.eu Reference links https://www.qualcomm.com/company/product-security/bulletins/march-2021-bulletin	Imported from gcve-enriched-dumps CVE data

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